3&B System Collet material with vespel, torlon and others (dissipative,insulative, conductive) which are depends on the customer requests has the specific characteristic with high temperature resistance, long life span, anti-static, no burrs or chips on the surface which effect the damages and etc..
Also it is widely used in picking up pakages such as low power devices , die bonding application, LED and etc..
3&B System can provides a variety of collets with a minimal processing hole Diameter of customer expectation or requests.
Open Collet – is used during the placement process when there is limited clearance between the die and other components as well as when the die surface is uneven
Close Collet – is used during the placement process when there is no clearance constraint between the die and other components.
With our limitless selection of tools, our customers will benefit from:
- High accuracy in die placement, eliminating die tilt
- Minimum contact with die surface, advantageous with sensitive dies
- Appropriate shank style
- Strong gripping, suitable especially for the Eutectic die bonding process
3&B System's ejector needle is widely used in die bonding application field and also sorting process which helps the packages dettached from the tape while the pick up tool operation.
For small die applications, use sub-micron grade carbide which prevents tip chipping
For larger die/non-piercing ejection, we recommend wear resistant carbide and an enlarged radius to reduce micro-cracking
Our needles offer top performance at a low cost combined with our accurate automatic machining process.
And we also can manufacture this part with various material such as tungsten carbide, high-speed steel, specialized plastic upon on customer requests. (OEM/ODM)